Jurusan Teknik Elektro

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Econo Product Quality Analysis
(2024-05-07) Luaha,Yohanes Melka Jaya; Arifin, Muhammad
The quality of semiconductor products has a big role in supporting the development of modern technology. Econo Products Low and Medium Power modules, Econo Products can helptechnological developments. This research aims to explore the concept of product quality in the context of the semiconductor industry, analyzing the factors that influence quality andcreating good quality results.
PERFORMANCE RATE DATA ANALYSIS OF OEE BY DATA RECORD SYSTEM MODIFICATION IN FINAL INSPECTION MACHINE
(2024-06-14) Firdaus, Muhammad; Prebianto, Nanta Fakih
The role of machinery is crucial in production to keep it optimized. The capacitor manufacturing process consists of assembly and final inspection. Analysis of the final inspection improvement shows that the decline in machine performance is caused by the repetition of inspection which causes lost time and affects the daily production time. The cause of detection errors is unpredictable and still unknown. This research measures the performance of machines in the manufacturing industry with the Overall Equipment Effectiveness (OEE) method and uses 7QC tools such as fishbone and flow charts. After the project was completed, it was found that the decline in the performance of the final inspection machine was due to a lack of focus in the analysis. The limited data after the final lot made it difficult to determine cameras with high inspection errors because inspection repetition data was not recorded. In this study, data from 10 manual inspection lots on each machine were taken, the average impact of re inspection was 14.1%, and the average performance after re-inspection was 81.6%. Camera 3 has the highest number of defects at 34% and camera 4 at 29%. The higher the number of camera defects, the greater the performance degradation in the inspection process.
Analysis of Tear and Service Life on Capillary Process Framebond Machine HK 133
(2024-07-06) Fauzan,Muhammad Al; Maulidiah,Hana Mutialif
The Capillary Bonding process is an important method in the assembly of semiconductor components that involves joining with the use of adhesive materials. The capillary is one of the main components along with the blade contained in a wire bonding machine system. Wire bonding machine system with a process using the HK-133 type which can affect productivity in the bonding process. Productivity in the bonding process. This study aims to analysis the frequent occurrence of rejects caused by calibration limits which include blade and capillary replacement. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, namely describe and analysis the problems, The research shows that every calibration and capillary limit that has been replaced will have an impact on good results, as well as increase productivity on the machine framebond HK 133.
Analysis Defect of the Econo PIM 3 Module in the Endtest Process (KWK 4)
(2024-06-14) Siregar, Willi Prayogi; Wikanta, Prasaja
The Econo PIM 3 Module is one of the module Processed through KWK 4 Machine in the Endtest Process Area. This module has a defect called Bent Pin and Burn Pin, so this research was prepared to find out the causes of the problems that occur and make improvements to prevent the occurence of these defects.
Comparative Analysis between SA-516 Gr 70 Material with SA-537 Class 2 Material in Shell Pressure Vessel Fabrication Process
(2024-07-31) Putri, Sarah Athaullah Wenna; Puspita, Widya Rika
Pressure vessel is a container to accommodate or store pressure fluids, both liquid and gas fluids which both have different pressures and temperatures. The pressure on the walls and body of the pressure vessel must be taken seriously, because it complies with applicable international design standards and priority the safety and security of workers. Research was conducted on a pressure vessel that aims to determine whether using the specified temperature affects the thickness of the shell to meet ASME standards. Research on shell components using SA-516 Gr 70 material and SA-537 material. Experiments were carried out with each material at temperatures of 250 C, 235 C, 343 C, where each material and temperature different thickness. The results of this research meet ASME standards because during the trial the thickness of the shell is not less than the actual thickness specified by the drawing. Which each experiment has an average value, namely SA-516 Gr 70 at 250 C with an average value of 13.25 mm, then at a temperature of 235 C the average value is 18.25 mm, at a temperature of 343 C the average value is 22.55 mm. While SA-537 Class 2 at a temperature of 250 C average value of 25.72 mm, at a temperature of 235 C average value of 18.31, at a temperature of 343 C average value of 13.82 mm.
Analysis Process Requirement After Safe Launch at Die Attach Process Focused on Package LDSO-14-2
(2024-07-23) Pratama,Efri; Jefiza,Adlian
Safe Launch is used in the semiconductor IC industry to describe and validation process before the final product is launched to production. In author department,the Process Integrated Department (PI) have responsbility to ensure the product meets all specified requirements. Die attach also known in semiconductor industry as die bonding, it is the process attaching die onto the leadframe. At Infineon, when a new product is about to be launched, PSFLA monitoring will be conducted. Products in PSFLA will be run with a production environment and will be assessed for each process, from pre-assembly to MSP test. In this project, the author will focus on the SFLA process of package LDSO-14-2 at Die Attach Process. Author must ensure that this package must meet the specifications and can be used and applied at PT Infineon Batam. For this project, the method of analysis used is box plot and pareto chart, after the safe launch of the die attach process has been carried out, the author can collect data and analyze related to the title of this project.
Clamper Buy Off Analysis and Storage Management at the Wire Bonding Process
(2024-07-23) Putriana, Wela; Sani, Abdullah
Wire bonding is the process of making interconnections between metallized bond pads with leads or other semiconductor devices with conducting wires. Inside the wire bonding machine there are various tools such as Clamper, which functions as a main frame holder during the bonding process. Before the clamper is used, it is necessary to purchase the clamper first, the purpose is to find out whether the clamper is according to standard or not and when the machine is running the technician can find out the problems associated with the clamper. The clamper will be tested and inspected both visually and testing, and from the results of the inspection a conclusion can be drawn about the clamper and the test data will be analyzed using the Box Plot method. Then, because there are many types of clampers with various packages in the Development Department that are not managed, for example where the clamper is stored, the current position of the clamper, its physical form and identity, it is necessary to make management to unite all data related to the clamper. This management method is in the form of database collection, then processed in excel software in the form of a system that is expected to facilitate users in the Development Department in finding information, storage and management of clamper inventory to be used.
Analysis of Lifted Metal Defect Improvement at Wire Bond Process for Imotion Device
(2024-07-24) Susanto, Nada Rindiani; Prebianto, Nanta Fakih
In the process of making IC (Integrated Circuit) through many processes, one of which is the wire bond process. The perfection of a product is a big reason to fulfill customer desires. Therefore, every product must be seen for its quality so that the product is perfect and there are no product defects in it. The wire bond process has many defects, one of which is the lifted metal defect. In this final project, researchers will discuss the improvement of lifted metal defects in the wire bond process which aims to develop or improve products so that defects do not occur again. In addition, researchers will also look for the root cause analysis of lifted metal through the parameters used in the wire bond process and find out the right parameters to reduce the occurrence of lifted metal defects. From the analysis obtained, researchers hope to find the right parameters to develop or improve the occurrence of lifted metal. Keywords: Integrated Circuit, Wire Bond, Defect Lifted Metal, Root Cause Analysis
Failure Analysis of IC (Econo) Modules in Dynamic,Static, and ISO Process
(2024-05-02) Alfath,Ridho Muhammad; Arifin,Muhammad
Dynamic, Static, and ISO are adapters that are useful for testing modules on the machine. In this system, Dynamic, Static, and ISO have their respective roles in the testing machine with the process of using a KWK 4-type machine. This research aims to analyze the frequent module rejects that occur in dynamic, static, and ISO. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. Keyword: Adapter, ISO, Dynamic, Static
Analysis Defect Insufficient Solder J2 on PCBA Model CG200-20244-004
(2024-07-23) Sembiring, Hanna Febriana Kirana Br; Octowinandi, Vivin
Insufficient Solder is a condition where there is not enough solder so that the solder is not able to form a good joint. In the production process of PCBA CG200-20244-004, there was an insufficient solder defect at the J2 location. This study aims to analyze the causes of insufficient solder defects using fishbone diagram. After the analysis, the author concluded that the insufficient solder defect occurred due to material factors, namely the thickness of the stencil not able to cover the coplanarity lead component. The stencil thickness used in this model is 3.5 mils or 0.089mm, but based on the results of the coplanarity measurement, there are several components with a coplanarity close to 0.089mm so that the stencil thickness is not able to cover the lead of component. One way to prevent defects from happening again is to increase the thickness of a special stencil at the J2 location from 3.5 mils to 5 mils. With the increase stencil thickness, the solder paste printing results also increase so that it is able to cover the coplanarity of the component.

Jurusan Teknik Elektro

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