D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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  • Repository Politeknik Negeri Batam
    Item
    Analysis the Cause of Wire Breaks in The Frame Bonding Process
    (2024-08-25) Ardiansyah Firman; Budiana
    The Frame Bonding process is also commonly known in the world of the Semiconductor industry as the Wire Bonding Process. This is the process of connecting a chip to a substrate via a wire bonded to a supporting structure, for example from a terminal pad to a substrate made of aluminum (Al). This process is an important process in the semiconductor backend to ensure the connection between the pad terminal and the substrate can be connected. Based on the background of the problems found, I conducted research aimed at reducing the occurrence of cable breaks which could result in the connection between the terminal pad and substrate on the BJ machine breaking down according to production quality standards. In this method we will look for engine stability on a BJ 920 type machine.
  • Repository Politeknik Negeri Batam
    Item
    Comparison of Auto Cutting and Semi Auto Cutting Work Systems on Wire Quality Achievement
    (Maria Oktaviani Christina.P, 2024-10-01) Oktaviani Christina.P, Maria; Budiana
    Cutting process is the process of cutting cables accompanied by inner or not inner, which this process must be in accordance with the drawing guidelines that have been determined by the company. In the cutting process, there are 2 cutting machines, namely an auto cutting machine and a semi auto cutting machine. This study aims to compare the results of the performance of auto and semi auto cutting on the achievement of wire quality in wire harness production. The statistical tests used were the F test and the Gage Repeatability and Reproducibility (GR & R) test to see the significance of the work performance of the Auto Cutting Machine and the Semi Auto Cutting Machine. The results of the efforts made by the author regarding the analysis carried out can be explained that it is the cutting machine that gets better cutting results while the semi-auto cutting machine still needs improvement.
  • Repository Politeknik Negeri Batam
    Item
    Improvement Yield to Increase Productivity for Model Light-2
    (2024-08-13) Hermin Iswanto Angga; Budiana
    Production yields one of the processes that need to control in manufacturer process to know the productivity of production. Production yield without control will negatively impact productivity and increase production costs. There are several reasons why production yield may not achieve the target, affecting costs due to elements such as Man, Method, Material, Machine, and Environment. To identify and address these issues, we will use the 4M+1E tools and capability statistics to analyze the problems and determine their origins and solutions. According to the analysis results using 4M+1E from the data (summary yield production, log data from the end-tester, component datasheets, schematics, and bench tests), we can identify the root causes of the problems. By comparing the data readings using distribution charts, we can determine the results. Based on the study of the manufacturing process using 4M+1E and capability statistics, it was concluded that the decrease in yield performance was caused by the machine test limit specification. Additionally, changing the machine test limit increased yield productivity, achieving a 99.99% success rate. This change was identified through an ECN and monitored over two months of production.