D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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Analisis Dan Optimasi Mesin End Tester Untuk Produksi Motor 6
(Politeknik Negeri Batam, 2023-07-11) Pardosi, Horas Damianto; Nakul, Fitriyanti; Dwijotomo, Abdurahman; Darmayono, Aditya Gautama
PT Siix Electronics Indonesia adalah perusahaan manufaktur yang memproduksi barang elektronik seperti Motor elektronik yang digunakan untuk LEGO Toys. Salah satu produknya bernama Motor 6 yang merupakan bagian integral dari aplikasi LEGO Mindstorms. Selama produksi bagian ini, dicatat bahwa beberapa produk memiliki masalah cacat terkait dengan sensor posisi di dalam motor 6. Kontribusi utama dari cacat sebagian besar karena posisi nol sensor motor 6 tidak sejajar. Tugas akhir ini mencoba memperbaiki kesalahan ini dengan menganalisis mesin produksi yang digunakan untuk membuat produk ini dan menemukan parameter yang berkontribusi terhadap cacat produk. Hasil analisis digunakan untuk menyetel mesin produksi bernama End-Tester Mesin untuk meminimalisir kesalahan. Berdasarkan analisa menggunakan metode kalibrasi sensor posisi penulis menyimpulkan bahwa penyebab terjadinya sensor posisi diakibatkan mesin end tester yang tidak berjalan dengan baik, setelah dilakukan penelitian mendapatkan hasil sekitar 85% bahwa produk cacat sudah berkurang dari sebelumnya. kedepannya beberapa kesalahan produksi yang disebabkan oleh sensor posisi yang tidak sejajar di dalam motor 6 dapat di evaluasi kembali agar dapat diminimalisir oleh teknisi dilokasi
Analisis Mesin Neoceed JHT Testing Handler Untuk DSO 300 mil
(Politeknik Negeri Batam, 2023-01-16) Siagian, Erwin Richard Tan; Gautama Aditya; Futra, Asrizal Deri; Arifin Muhammad
PT Infineon Technologies Batam adalah perusahaan yang bergerak dibidang semikonduktor. Banyak perusahaan yang ingin maju dan bersaing untuk kualitas produknya demi memuaskan permintaan customer. PT. Infineon Technologies Batam membuat suatu produk semikonduktor seperti IC ( Integrated Circuit ), mikrokontroller dan smart card IC . Testing adalah sebuah proses pengujian electrical test pada sebuah package/device , yang dimana ini adalah salah satu proses terakhir (End of Line) pada process flow yang ada di PT. Infineon Technologies Batam. Terutama didepartemen TTI FT TC (Test Technologies and Innvovation, Final Test and Test Cell).
Analysis Broken Wire Module Econo Pack+B in Wire Bonding Process
(2024-07-08) Pakpahan, Steven; Sani, Abdullah
Since the establishment of the new Econo line back end site, Infineon Technologies Cegled Kft has experienced quite rapid improvements in every production line including the wire bonding area. This increase in production in the wire bonding area resulted in a high number of rejected broken wires which resulted in failure of the Econo Pack+B product which resulted in expensive production costs resulting in losses for the company and production output not being achieved. So that the root cause of the broken wire defect can be known for certain and controlled which will have an impact on improving the quality process and achieving the production target yield of 95.4% to increase the key performance indicator of the production area and achieving a stable process in the wire bonding process based on the value cpk shear test.
Analysis Defect Alignment Out pada PCB saat proses Mounting
(Politeknik Negeri Batam, 2023-01-16) Gultom,Fransiskus Juanda; Sani,Abdullah
Surface Mount Technology atau sering disebut SMT merupakan teknologi terbaru yang digunakan untuk menempelkan komponen elektronik ke permukaan PCB. Komponen elektronik yang dapat dipasang oleh mesin SMT adalah komponen Surface Mount Device (SMD).
Analysis Defect Insufficient Solder J2 on PCBA Model CG200-20244-004
(2024-07-23) Sembiring, Hanna Febriana Kirana Br; Octowinandi, Vivin
Insufficient Solder is a condition where there is not enough solder so that the solder is not able to form a good joint. In the production process of PCBA CG200-20244-004, there was an insufficient solder defect at the J2 location. This study aims to analyze the causes of insufficient solder defects using fishbone diagram. After the analysis, the author concluded that the insufficient solder defect occurred due to material factors, namely the thickness of the stencil not able to cover the coplanarity lead component. The stencil thickness used in this model is 3.5 mils or 0.089mm, but based on the results of the coplanarity measurement, there are several components with a coplanarity close to 0.089mm so that the stencil thickness is not able to cover the lead of component. One way to prevent defects from happening again is to increase the thickness of a special stencil at the J2 location from 3.5 mils to 5 mils. With the increase stencil thickness, the solder paste printing results also increase so that it is able to cover the coplanarity of the component.
Analysis Defect Non-Wetting U7 on PCBA Model DM3XX
(Politeknik Negeri Batam, 2023-07-11) Nasution, Adnan Octaridho; Asaad, Nur Sakinah; Octowinandi, Vivin; Muhammad Arifin
The DM3XX production process, non-Wetting rejects were found. The most difficult aspect of any solder defect on area array package is inability to observe defect easily. It's important to understand the characteristics of solder defects to identify appropriate actions to reduce defects in soldering process. Head-in-pillow defects are solder defects in area array packages characterized by a lack of coalescence between the solders. The purpose of this study was to determine causes of Non-Wetting U7 IC (CG201-10022-1R00) DM3XX and to prevent occurrence of Non-Wetting U7 IC DM3XX. To find out causal factors and prevent occurrence of U7 IC Non-Wetting, a fishbone diagram approach and mapping process are needed in this study. After analysis using fishbone diagram and why why analysis, defect non-Wetting caused by bent U7 leads, resulting in uneven soldering in reflow process. The bent position of U7 leads can't be corrected in other SMT processes. It can only be prevented using AOI. The AOI value required in non-wetting to process assembly is at level 70 for lower and 70 upper spec checking. Both factors have contributed to the decrease in reject produced by the process. Has an influence of 98.92% so it will be effective when implemented.
Analysis Defect of the Econo PIM 3 Module in the Endtest Process (KWK 4)
(2024-06-14) Siregar, Willi Prayogi; Wikanta, Prasaja
The Econo PIM 3 Module is one of the module Processed through KWK 4 Machine in the Endtest Process Area. This module has a defect called Bent Pin and Burn Pin, so this research was prepared to find out the causes of the problems that occur and make improvements to prevent the occurence of these defects.
Analysis of Defect Issues in Wire Bond ASM I Hawk Extreme 099 Before-After Preventive Maintenance(PM)
(Politeknik Negeri Batam, 2023-07-11) Permadhi, Dede Gading; Prebianto, Nanta Fakih; ; Wijanarko, Heru
Non-stick on pad (NSOP) is a defect that falls under the defect category and is very problematic to the manufacturing process because it can cause the production machine to stop working immediately and prevent the material from being reused or removed. The production schedule was thrown off when NSOP issues appeared. This causes a lot of unplanned downtime and may cause it to exceed the management of the company's recommended range. The IHAWK Extreme 099 ASM machine was studied by the authors utilizing the fishbone method, where the fishbone itself is highly useful in determining the reason of errors that occur besides that the author also uses DOE (Design of Experiment) to find the best parameters use. Find causes of NSOP is the goal of this study, defects on the machine minimize the possibility that NSOP defects will develop on the machine, and increase the machine's output. The results of the research are get 1 good parameter to use in production line, there is use 116 DAC (Digital analog Convert) for the Bond Power Parameters, use 35 gf for the Bond Force Parameter. After this parameters implemented during production running, the number of occurrences of NSOP issues can be reduced to 42%.
Analysis of Glueing Damage on the Baseplate
(2024-06-06) Pohan, Dam Huri; Sugandi, Budi
Glueing is one of the main components located in the GFR machine system (glueing, frame mounting, riveting). which can affect productivity in the gluing process on the base plate. This study aims to analyze the frequent glueing damage in single dual modules and pim2 & steck2 modules, econo dual caused by parameter setting errors and WT usage errors, curved needles, contaminated needles, soldering along adhesive lines, adhesive contour shifts. The analytical method used in this study is qualitative analysis method. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. The results showed that every use of the correct parameters and the use of the right WT will have an impact on good results, as well as increase productivity on GFR machines.
Analysis of Lifted Metal Defect Improvement at Wire Bond Process for Imotion Device
(2024-07-24) Susanto, Nada Rindiani; Prebianto, Nanta Fakih
In the process of making IC (Integrated Circuit) through many processes, one of which is the wire bond process. The perfection of a product is a big reason to fulfill customer desires. Therefore, every product must be seen for its quality so that the product is perfect and there are no product defects in it. The wire bond process has many defects, one of which is the lifted metal defect. In this final project, researchers will discuss the improvement of lifted metal defects in the wire bond process which aims to develop or improve products so that defects do not occur again. In addition, researchers will also look for the root cause analysis of lifted metal through the parameters used in the wire bond process and find out the right parameters to reduce the occurrence of lifted metal defects. From the analysis obtained, researchers hope to find the right parameters to develop or improve the occurrence of lifted metal. Keywords: Integrated Circuit, Wire Bond, Defect Lifted Metal, Root Cause Analysis
Analysis Of Needle Pin Adapter Dynamics In IGBT Module Endtest Process
(2024-06-29) Mufriki,Achmad; Octowinandi,Vivin
Needle Pin is a needle located on the dynamic adapter and functions to provide voltage to the IGBT module pins during the Endtest process. Many testing processes are not completed on time because some processes do not run according to schedule, especially in the Endtest process due to delays which result in long downtime, one of which is due to problems with testing dynamics. Damage to the dynamic adapter is mainly burnt and jammed needle pins. The author uses the fishbone method/Ishikawa diagram to find out the factors and root causes that cause burnt needle pins. The main root cause in this research is contaminated pins module. This research found that the value of P1 The average machine downtime before repair was 68.83 minutes, min 30 minutes and maximum 115 minutes and the percentage was 71.69%. And the value of P2 The average machine downtime after repairs was 55.08 minutes and the min was 20 minutes and the maximum was 85 minutes and the percentage was 57.37%. Based on the matrix, the comparison range for P1 and P2 is 14.32%.
Analysis Of Pin Needle Adapter Dynamics In The IGBT Module Endtest Process
(2024-06-29) Mufriki,Achmad; Octowinandi,Vivin
Needle Pin is a needle located on the dynamic adapter and functions to provide voltage to the IGBT module pins during the Endtest process. Many testing processes are not completed on time because some processes do not run according to schedule, especially in the Endtest process due to delays which result in long downtime, one of which is due to problems with testing dynamics. Damage to the dynamic adapter is mainly burnt and jammed needle pins. The author uses the fishbone method/Ishikawa diagram to find out the factors and root causes that cause burnt needle pins. The main root cause in this research is contaminated pins module. This research found that the value of P1 The average machine downtime before repair was 68.83 minutes, min 30 minutes and maximum 115 minutes and the percentage was 71.69%. And the value of P2 The average machine downtime after repairs was 55.08 minutes and the min was 20 minutes and the maximum was 85 minutes and the percentage was 57.37%. Based on the matrix, the comparison range for P1 and P2 is 14.32%.
Analysis of Tear and Service Life on Capillary Process Framebond Machine HK 133
(2024-07-06) Fauzan,Muhammad Al; Maulidiah,Hana Mutialif
The Capillary Bonding process is an important method in the assembly of semiconductor components that involves joining with the use of adhesive materials. The capillary is one of the main components along with the blade contained in a wire bonding machine system. Wire bonding machine system with a process using the HK-133 type which can affect productivity in the bonding process. Productivity in the bonding process. This study aims to analysis the frequent occurrence of rejects caused by calibration limits which include blade and capillary replacement. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, namely describe and analysis the problems, The research shows that every calibration and capillary limit that has been replaced will have an impact on good results, as well as increase productivity on the machine framebond HK 133.
Analysis of the Needle Pin on the Adapter Dynamikus in KWK 1
(2024-02-25) Farhan,Reihan Agustino; Maulidiah,Hana Mutialif
Dynamikus is to check whether the module survives at the specified temperature and test the durability of the module, this research aims to analyze the failure of the needle pin then explain the impact of failure on the module, the causes of module problems, failures in the adapter and module, in this research the author is focused on one of the machines used is the KWK 1 machine, the KWK machine is a machine used to check or test the durability of the module, whether the quality of the module has been tested and the discussion in this analysis is focused on the DYNAMICUS adapter. This discussion concerns failures in the needle module and needle adapter, to understand how to reduce failures in the module and what prevents failure, the causes why. The analytical method used in this research is qualitative analysis, this type of research uses a qualitative descriptive approach that describes and analyzes the problems found. Keywords: Adapter,Dynamikus,Needle Pin
Analyzing Wire Breakage Failure During Bonding Process
(2024-06-14) Sinaga,Marupa Daniel; Wivanius,Nadrah
Frame bonding is the name of an area at infineon with a working method of connecting cables to frames or ic. the author took this title because of the author's anxiety about the failure of this bonding process. And the author took a qualitative method by asking all technicians regarding the failures that occurred in this process. Keywords: Bonding,Wire,Failure,Capillary
Automated Stopper Interlink With Application IPQA Audit
(Politeknik Negeri Batam, 2023-07-11) Putra, Frama Dani; Budiana; Adlian, Jefiza; Octowinandi, Vivin
PT. Flextronics Technology Indonesia is a service company engaged in global electronics manufacturing (Electronic Manufactured Service/EMS). In the electronics manufacturing process, several processes are required to ensure that the products produced comply with ISO 9001:2015 standards. One of the processes carried out in the industrial world is the inspection or audit process. Audit Inspection is the first process to ensure the quality of a product that is produced before the product is run continuously. The inspection process is carried out by IPQA using the IPQA Audit application. Where if the product running at the time of the audit does not meet the application criteria the Audit will detect a Fail so that the Production Process will be stopped by the IPQA operator. However, the process of notifying a production line stop is time consuming, causing some products to be missed and causing costs to rework products which result in production costs being incurred. Therefore, an Auto Stopper tool is designed that is connected to the IPQA machine and application. Kata kunci : Audit, ISO 9001:2015, Aplikasi IPQA, Stopper.
Comparison of Data Before and After Reverse Engineering on PCB Channel
(2024-07-23) Saputra,Dicky Aryayuda; Prebianto,Nanta Fakih
The BIT (Build In Test) process is the process of checking the function of household electrical products such as coffee brewer machines, this test uses a machine called MC3 BIT. Inside the MC3 BIT machine there are various kinds of PCBs, namely PCB Channel, PCB data filter, PCB Volt filter, 120V travo, and so on. And the MC3 BIT machine also needs a PCB Channel so that the functions of the product can be read on the PCB Channel. To perform reverse engineering, PCB Channel needs to perform 2 methods, namely disassembly and reassembly. This method is not only used to engineer PCBs, but also can reverse engineer software, machinery, aircraft, architectural structures, PCBs and other products that are deconstructed to extract design information from them. However, re-engineering a channel PCB will take a very long time, because theauthor needs to research more deeply about the value of the components in the channel PCB and also research the paths on the channel PCB. for this reason, analysis methods such as Disassembly and Reassembly are needed, and continued by making a schematic. for the test, the author needs 1 day for 1 Channel PCB
Cycle Time Improvement for Soldering Process on the Assembly Process of RFID Card
(Politeknik Negeri Batam, 2023-01-16) Suryono, Tino; Arifin, Muhammad; Mustanir; Sani, Abdullah; Asaad, Nur Sakinah
Teaching Factory Manufacturing of Electronics (TFME) is facility of Politeknik Negeri Batam that designed according to the real industry orientation in Batam. TFME already had mass producing RFID Card for student ID card Politeknik Negeri Batam with production output is 400 units per week. Several items need to be considered during mass production which is quality, quantity (output) and production costs. Profit will be achieved when we produced unit with high output and low cost. Based on the analysis and collecting data showing that Soldering Antenna on the assembly of RFID Card is the bottle neck process with high of cycle time consuming 180 sec/unit.
Defect Analysis in Riveting Process
(2024) Marpaung, Willi Ferry Chaves; Arifin, Muhammad
Riveting is one of a process in making modules in Infineon Technologies – Hungary, Cegled. Rivet is the act of spreading out and clinching the end by pressing. Riveting has advantages such as a compact module concept, optimized customer development cycle time and cost, and configuration flexibility. The process of attaching the frame to the baseplate consists of DCB. However, everything that has advantages also has its disadvantages; also, in riveting, there are some disadvantages. So, the author does a final project titled “ Defect Analysis In Riveting Process ”.To analyze products, they can be classified as scrap or not. In this research, I used the fishbone diagram, diagram chart, and the data collection methods the authors used in this project to determine most often defects happen in the riveting process. The module that will analyzed is the dual module.
Design and Set Up of Signal Light Inspection Tool Using Microcontroller Based on a Data Logger
(Politeknik Negeri Batam, 2023-03-31) Panggabean, Ronni Lodiwik; Wijanarko, Heru; Maulidiah, Hana Mutialif; Prebianto, Nanta Fakih
PT Patlite Indonesia is a Warning Signal Lamp manufacturing industry that has grown rapidly since its inception. In the process of making signal lights, several processes are needed to ensure that the products produced are by ISO 9001: 2015 standards. One of the processes carried out in the industrial world is the inspection process. Inspection is a process carried out to ensure the quality of a product produced in accordance with standards, regulations, and customer satisfaction results. The use of a checksheet is one of the inspection processes carried out to assess the quality of the product produced. However, using check sheets to assess product quality requires a lot of time and effort in recording the results of each inspection. Therefore, a Signal Light Inspection Tool was designed using a Data Logger-Based Microcontroller that can store inspection data automatically. An inspection tool made using the data logger method to store data from signal light inspection results. This inspection tool has been successfully tested on 4 product models with productivity efficiency results of 111.8%. The inspection tool created has the advantage of being able to store the results of flow inspection data automatically, shorten production time and increase production output data.