D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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Analysis Broken Wire Module Econo Pack+B in Wire Bonding Process
(2024-07-08) Pakpahan, Steven; Sani, Abdullah
Since the establishment of the new Econo line back end site, Infineon Technologies Cegled Kft has experienced quite rapid improvements in every production line including the wire bonding area. This increase in production in the wire bonding area resulted in a high number of rejected broken wires which resulted in failure of the Econo Pack+B product which resulted in expensive production costs resulting in losses for the company and production output not being achieved. So that the root cause of the broken wire defect can be known for certain and controlled which will have an impact on improving the quality process and achieving the production target yield of 95.4% to increase the key performance indicator of the production area and achieving a stable process in the wire bonding process based on the value cpk shear test.
Analysis Defect Insufficient Solder J2 on PCBA Model CG200-20244-004
(2024-07-23) Sembiring, Hanna Febriana Kirana Br; Octowinandi, Vivin
Insufficient Solder is a condition where there is not enough solder so that the solder is not able to form a good joint. In the production process of PCBA CG200-20244-004, there was an insufficient solder defect at the J2 location. This study aims to analyze the causes of insufficient solder defects using fishbone diagram. After the analysis, the author concluded that the insufficient solder defect occurred due to material factors, namely the thickness of the stencil not able to cover the coplanarity lead component. The stencil thickness used in this model is 3.5 mils or 0.089mm, but based on the results of the coplanarity measurement, there are several components with a coplanarity close to 0.089mm so that the stencil thickness is not able to cover the lead of component. One way to prevent defects from happening again is to increase the thickness of a special stencil at the J2 location from 3.5 mils to 5 mils. With the increase stencil thickness, the solder paste printing results also increase so that it is able to cover the coplanarity of the component.
Analysis Defect of the Econo PIM 3 Module in the Endtest Process (KWK 4)
(2024-06-14) Siregar, Willi Prayogi; Wikanta, Prasaja
The Econo PIM 3 Module is one of the module Processed through KWK 4 Machine in the Endtest Process Area. This module has a defect called Bent Pin and Burn Pin, so this research was prepared to find out the causes of the problems that occur and make improvements to prevent the occurence of these defects.
Analysis of Defect Issues in Wire Bond ASM I Hawk Extreme 099 Before-After Preventive Maintenance(PM)
(Politeknik Negeri Batam, 2023-07-11) Permadhi, Dede Gading; Prebianto, Nanta Fakih; ; Wijanarko, Heru
Non-stick on pad (NSOP) is a defect that falls under the defect category and is very problematic to the manufacturing process because it can cause the production machine to stop working immediately and prevent the material from being reused or removed. The production schedule was thrown off when NSOP issues appeared. This causes a lot of unplanned downtime and may cause it to exceed the management of the company's recommended range. The IHAWK Extreme 099 ASM machine was studied by the authors utilizing the fishbone method, where the fishbone itself is highly useful in determining the reason of errors that occur besides that the author also uses DOE (Design of Experiment) to find the best parameters use. Find causes of NSOP is the goal of this study, defects on the machine minimize the possibility that NSOP defects will develop on the machine, and increase the machine's output. The results of the research are get 1 good parameter to use in production line, there is use 116 DAC (Digital analog Convert) for the Bond Power Parameters, use 35 gf for the Bond Force Parameter. After this parameters implemented during production running, the number of occurrences of NSOP issues can be reduced to 42%.
Analysis of Glueing Damage on the Baseplate
(2024-06-06) Pohan, Dam Huri; Sugandi, Budi
Glueing is one of the main components located in the GFR machine system (glueing, frame mounting, riveting). which can affect productivity in the gluing process on the base plate. This study aims to analyze the frequent glueing damage in single dual modules and pim2 & steck2 modules, econo dual caused by parameter setting errors and WT usage errors, curved needles, contaminated needles, soldering along adhesive lines, adhesive contour shifts. The analytical method used in this study is qualitative analysis method. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. The results showed that every use of the correct parameters and the use of the right WT will have an impact on good results, as well as increase productivity on GFR machines.
Analysis of Lifted Metal Defect Improvement at Wire Bond Process for Imotion Device
(2024-07-24) Susanto, Nada Rindiani; Prebianto, Nanta Fakih
In the process of making IC (Integrated Circuit) through many processes, one of which is the wire bond process. The perfection of a product is a big reason to fulfill customer desires. Therefore, every product must be seen for its quality so that the product is perfect and there are no product defects in it. The wire bond process has many defects, one of which is the lifted metal defect. In this final project, researchers will discuss the improvement of lifted metal defects in the wire bond process which aims to develop or improve products so that defects do not occur again. In addition, researchers will also look for the root cause analysis of lifted metal through the parameters used in the wire bond process and find out the right parameters to reduce the occurrence of lifted metal defects. From the analysis obtained, researchers hope to find the right parameters to develop or improve the occurrence of lifted metal. Keywords: Integrated Circuit, Wire Bond, Defect Lifted Metal, Root Cause Analysis
Analysis Of Needle Pin Adapter Dynamics In IGBT Module Endtest Process
(2024-06-29) Mufriki,Achmad; Octowinandi,Vivin
Needle Pin is a needle located on the dynamic adapter and functions to provide voltage to the IGBT module pins during the Endtest process. Many testing processes are not completed on time because some processes do not run according to schedule, especially in the Endtest process due to delays which result in long downtime, one of which is due to problems with testing dynamics. Damage to the dynamic adapter is mainly burnt and jammed needle pins. The author uses the fishbone method/Ishikawa diagram to find out the factors and root causes that cause burnt needle pins. The main root cause in this research is contaminated pins module. This research found that the value of P1 The average machine downtime before repair was 68.83 minutes, min 30 minutes and maximum 115 minutes and the percentage was 71.69%. And the value of P2 The average machine downtime after repairs was 55.08 minutes and the min was 20 minutes and the maximum was 85 minutes and the percentage was 57.37%. Based on the matrix, the comparison range for P1 and P2 is 14.32%.
Analysis of Tear and Service Life on Capillary Process Framebond Machine HK 133
(2024-07-06) Fauzan,Muhammad Al; Maulidiah,Hana Mutialif
The Capillary Bonding process is an important method in the assembly of semiconductor components that involves joining with the use of adhesive materials. The capillary is one of the main components along with the blade contained in a wire bonding machine system. Wire bonding machine system with a process using the HK-133 type which can affect productivity in the bonding process. Productivity in the bonding process. This study aims to analysis the frequent occurrence of rejects caused by calibration limits which include blade and capillary replacement. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, namely describe and analysis the problems, The research shows that every calibration and capillary limit that has been replaced will have an impact on good results, as well as increase productivity on the machine framebond HK 133.
Analysis of the Needle Pin on the Adapter Dynamikus in KWK 1
(2024-02-25) Farhan,Reihan Agustino; Maulidiah,Hana Mutialif
Dynamikus is to check whether the module survives at the specified temperature and test the durability of the module, this research aims to analyze the failure of the needle pin then explain the impact of failure on the module, the causes of module problems, failures in the adapter and module, in this research the author is focused on one of the machines used is the KWK 1 machine, the KWK machine is a machine used to check or test the durability of the module, whether the quality of the module has been tested and the discussion in this analysis is focused on the DYNAMICUS adapter. This discussion concerns failures in the needle module and needle adapter, to understand how to reduce failures in the module and what prevents failure, the causes why. The analytical method used in this research is qualitative analysis, this type of research uses a qualitative descriptive approach that describes and analyzes the problems found. Keywords: Adapter,Dynamikus,Needle Pin
Analyzing Wire Breakage Failure During Bonding Process
(2024-06-14) Sinaga,Marupa Daniel; Wivanius,Nadrah
Frame bonding is the name of an area at infineon with a working method of connecting cables to frames or ic. the author took this title because of the author's anxiety about the failure of this bonding process. And the author took a qualitative method by asking all technicians regarding the failures that occurred in this process. Keywords: Bonding,Wire,Failure,Capillary
Comparison of Data Before and After Reverse Engineering on PCB Channel
(2024-07-23) Saputra,Dicky Aryayuda; Prebianto,Nanta Fakih
The BIT (Build In Test) process is the process of checking the function of household electrical products such as coffee brewer machines, this test uses a machine called MC3 BIT. Inside the MC3 BIT machine there are various kinds of PCBs, namely PCB Channel, PCB data filter, PCB Volt filter, 120V travo, and so on. And the MC3 BIT machine also needs a PCB Channel so that the functions of the product can be read on the PCB Channel. To perform reverse engineering, PCB Channel needs to perform 2 methods, namely disassembly and reassembly. This method is not only used to engineer PCBs, but also can reverse engineer software, machinery, aircraft, architectural structures, PCBs and other products that are deconstructed to extract design information from them. However, re-engineering a channel PCB will take a very long time, because theauthor needs to research more deeply about the value of the components in the channel PCB and also research the paths on the channel PCB. for this reason, analysis methods such as Disassembly and Reassembly are needed, and continued by making a schematic. for the test, the author needs 1 day for 1 Channel PCB
Defect Analysis in Riveting Process
(2024) Marpaung, Willi Ferry Chaves; Arifin, Muhammad
Riveting is one of a process in making modules in Infineon Technologies – Hungary, Cegled. Rivet is the act of spreading out and clinching the end by pressing. Riveting has advantages such as a compact module concept, optimized customer development cycle time and cost, and configuration flexibility. The process of attaching the frame to the baseplate consists of DCB. However, everything that has advantages also has its disadvantages; also, in riveting, there are some disadvantages. So, the author does a final project titled “ Defect Analysis In Riveting Process ”.To analyze products, they can be classified as scrap or not. In this research, I used the fishbone diagram, diagram chart, and the data collection methods the authors used in this project to determine most often defects happen in the riveting process. The module that will analyzed is the dual module.
Econo Product Quality Analysis
(2024-05-07) Luaha,Yohanes Melka Jaya; Arifin, Muhammad
The quality of semiconductor products has a big role in supporting the development of modern technology. Econo Products Low and Medium Power modules, Econo Products can helptechnological developments. This research aims to explore the concept of product quality in the context of the semiconductor industry, analyzing the factors that influence quality andcreating good quality results.
Failure Analysis of Electric Car Modules: Case Investigation on Econo Pack+B Products in Measurement Testing
(2024-06-03) Dinata Farhan Muhammad; Sani Abdullah
As demand continues to increase, Infineon Technology AG is facing an increase in production orders, which is a positive thing but also brings serious challenges in the process. This study aims to identify problems that arise in production by conducting an in-depth analysis of a crucial component in electric vehicles, The method used to solve the problem by making improvements to product quality testing, by making measurement tools. The results of observations of production defects for 3 months reached 4.72%, so the authors investigated the problem and made improvements to production using measurement tools. So that the results of defect observations using the method have changed Significant, Showing a figure of 0.56% in observations again for 3 months.
Failure Analysis of IC (Econo) Modules in Dynamic,Static, and ISO Process
(2024-05-02) Alfath,Ridho Muhammad; Arifin,Muhammad
Dynamic, Static, and ISO are adapters that are useful for testing modules on the machine. In this system, Dynamic, Static, and ISO have their respective roles in the testing machine with the process of using a KWK 4-type machine. This research aims to analyze the frequent module rejects that occur in dynamic, static, and ISO. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. Keyword: Adapter, ISO, Dynamic, Static
Failure Analysis of Module Assembly on Combi Machine (Gluing and Riveting)
(2024-07-09) Sihite,Baktiar; Wikanta,Prasaja
PT Infineon Technologies Cegled is a company operating in the semiconductor sector, PT Infineon Technologies Cegled was founded in 1996. PT Infineon Technologies Cegled produces high-power semiconductor modules to support the advancement of various technologies, such as electric cars and environmentally friendly turbines. In assembling a module, there are various process stages that go through, one of the processes is frame assembly. Several stages in the frame assembly process, namely Chip Attachment - PCB Wire Assembly - X-ray - AOI - Glue - Frame Installation - Riveting. During the module assembly process, there were several product failures caused by imperfect glue on the packaging and poor clamp installation. This results in the module not meeting the company's quality standards, where the company has good or appropriate product quality standards.
PERFORMANCE RATE DATA ANALYSIS OF OEE BY DATA RECORD SYSTEM MODIFICATION IN FINAL INSPECTION MACHINE
(2024-06-14) Firdaus, Muhammad; Prebianto, Nanta Fakih
The role of machinery is crucial in production to keep it optimized. The capacitor manufacturing process consists of assembly and final inspection. Analysis of the final inspection improvement shows that the decline in machine performance is caused by the repetition of inspection which causes lost time and affects the daily production time. The cause of detection errors is unpredictable and still unknown. This research measures the performance of machines in the manufacturing industry with the Overall Equipment Effectiveness (OEE) method and uses 7QC tools such as fishbone and flow charts. After the project was completed, it was found that the decline in the performance of the final inspection machine was due to a lack of focus in the analysis. The limited data after the final lot made it difficult to determine cameras with high inspection errors because inspection repetition data was not recorded. In this study, data from 10 manual inspection lots on each machine were taken, the average impact of re inspection was 14.1%, and the average performance after re-inspection was 81.6%. Camera 3 has the highest number of defects at 34% and camera 4 at 29%. The higher the number of camera defects, the greater the performance degradation in the inspection process.
Scrap Analysis on Econo Pim 3 Module
(2024-06-24) Sitompul, Stephen; Nakul, Fitriyanti
Econo pim 3 module is one of the manufactured products that has a good summary of features as highs power density, integrated temperature sensor available and RoHS- compliant module. Econo pim 3 module also has advantages as compact module concept, optimized customers development cycle time and cost, configuration flexibility and econo pim 3 module can be applied to motor control and drives, industrial heating and welding and room air conditioners. But with all that advantages econo pim 3 module must go through a long process, during the manufacturing process the module is found scrap or not suitable to use, from many manufacturing process system soldering process is bottle neck of scrap found. The purpose of this research is to find the root cause of econo pim 3 module defects during system soldering process and to analysis defects that occur. This research uses the fishbone diagram method, which fishbone diagram is certainly carried help full in knowing the cause of the defects occurs. Fishbone diagram, also called as ‘cause-and-effect’ diagram, is a tool used to identify the root cause of problems which represents the effect and the factors or causes influencing it. [1] Keywords: Defects, Pim 3 Module, System Soldering Process, Fishbone diagram